In July 2026, TFME (Tongfu Microelectronics) incorporated TFME Shenzhen Microelectronics Co., Ltd. – a wholly-owned subsidiary with registered capital of RMB 1 billion ($~140M) , located in Shenzhen’s Qianhai Cooperation Zone. The move marks a strategic shift from a pure-play OSAT to a full-spectrum semiconductor service provider.

According to business registration records, the subsidiary’s scope extends far beyond packaging and testing – covering IC design, wafer manufacturing, semiconductor equipment production, device sales, and import/export. This positions TFME to expand upstream into equipment R&D and downstream into chip design and fabrication, while its existing Jiangsu and Shanghai fabs serve as the central manufacturing backbone.

Shenzhen’s proximity to major OEMs, fabless design houses, and end-market demand will sharply improve response times for design-in, sample validation, and delivery. The subsidiary also strengthens the Greater Bay Area’s semiconductor ecosystem, adding critical packaging/test capability to complement regional design and wafer fabrication.

TFME remains one of the top global OSAT players and a key AMD packaging partner. On the back of the AI-driven upcycle and memory recovery, the company guided H1 2026 net profit at RMB 1.6–1.8 billion – up 288–337% YoY – with production lines running at full capacity.

From ICgoodFind: TFME is no longer just a packaging house – it's building a full-chain presence. Shenzhen gives it design-side access and equipment capabilities, turning a foundry cycle winner into a broader semiconductor platform.