On January 21, global leading integrated circuit packaging and test service provider JCET announced a key breakthrough in Co‑Packaged Optics (CPO) technology. Its silicon photonics engine product, developed based on the proprietary XDFOI® multi‑dimensional heterogeneous integration advanced packaging platform, has successfully completed customer sample delivery and passed testing, achieving technical validation and taking a crucial step toward scalable application.
With ongoing explosive demand for high‑performance computing, market requirements for high bandwidth, low latency, and energy‑efficient optical interconnect technology are growing increasingly urgent. CPO technology integrates photonic and electronic devices through advanced packaging, rearchitecting data‑transfer systems to provide compact and efficient solutions for next‑generation high‑performance computing and is seen as a core approach to overcoming computational bottlenecks.
JCET has been engaged in CPO development for some time, having established deep partnerships with multiple clients and providing end‑to‑end support from R&D to production capacity. The successful “power‑on” of the silicon photonics engine at the customer site leverages high‑density integration within the package to effectively optimize energy efficiency and bandwidth, reduce interconnect loss, and significantly improve system scalability.
As a core technology for next‑generation computing infrastructure, CPO plays a critical role in both Scale‑Up and Scale‑Out networks and is regarded as a foundational element for future computing systems. Currently, silicon photonics industry collaboration is advancing, with the CPO ecosystem steadily maturing across the entire chain—covering design, manufacturing, packaging/testing, and system validation—paving the way for large‑scale adoption.
The scale‑up of CPO technology relies on collaborative innovation across the industry. Moving forward, JCET will continue to strengthen R&D in advanced packaging, focus on building core capabilities, and iterate its technology and services to deliver reliable solutions for high‑performance computing, data centers, and other critical applications, supporting global computing‑power upgrades.
ICgoodFind : JCET’s delivery of CPO samples demonstrates market recognition of its technical capabilities and will accelerate CPO industrialization, while also helping to advance the domestic advanced packaging and computing‑power supply chain.
